发明名称 |
PARTIAL PLATING METHOD AND PRESSER JIG USED THEREFOR |
摘要 |
PURPOSE:To propose a partial plating method which prevents harmful plating deposited on the side of a lead frame capable of prevent the effects induced by the shape of the lead frame and a presser jig adopted for the above method in terms of a process which consumes expensive Au and Ag and die-bonding process and wire-bonding process. CONSTITUTION:This invention covers a partial plating method and a presser jig adopted for the plating method where the surface of a metal plate 4 having the same shape to that of a minimum plating area for a lead frame 1 is cover with an insulator 5 between elastic body 2 on the rear side and a plating mask 3 on the front side so as to produce a presser jig 6 and the plating is interposed and aligned with the lead frame 1 on the front side of the insulation 5 of the presser jig. |
申请公布号 |
JPH06151675(A) |
申请公布日期 |
1994.05.31 |
申请号 |
JP19920314393 |
申请日期 |
1992.10.30 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
TANAKA HITOSHI;MATSUMURA KENJI |
分类号 |
C25D5/02;C25D7/00;C25D7/12;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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