| 摘要 |
PURPOSE:To prevent air pollution before the processing of a processed body, to improve a product yield, and to achieve the effective utilization of an installation space and the miniaturization of a transfer processing device. CONSTITUTION:Processing chambers 1a and 1b, storage chambers 2a and 2b, and a pre-processing storage chamber 3 are disposed around a transfer chamber 4 via gate valves 5. A transfer means 6 is disposed in the transfer chamber 4 for managing the transfer of a wafer W from and into the processing chambers 1a and 1b, the storage chambers 2a and 2b and the pre-processing storage chamber 3. An N2 gas supply source 8 is connected respectively to the processing chambers 1a and 1b, the storage chambers 2a and 2b, the pre- processing chamber 3 and the transfer chamber 4 via an N2 gas supply pipe 7. Also, a vacuum pump 10 is connected to them via an exhaust pipe 9. Thereby, the processing chambers 1a and 1b, the storage chambers 2a and 2b, the pre- processing chamber 3 and the transfer chamber 4 are filled with an atmosphere of N2 gas, and hence it is possible to prevent the adhesion of a natural oxide film and particles to the surface of the wafer W in a non-processed state or while it is being processed. |
