发明名称 Enclosing a substate with a heat-recoverable article
摘要 A substrate (12, 14) is enclosed with a heat recoverable backing with a layer of a thermosetting adhesive composition (20) comprising an amorphous thermoplastic resin and a thermosetting resin positioned between the heat recoverable article (10, 26) and the substrate (12, 14). The adhesive composition can be in the form of a self-supporting sheet or tape or it can be on a surface of the heat recoverable article (10). When particulate conductive filler is added to the adhesive, a conductive polymer composition can be made. Such conductive compositions are suitable for use for static dissipation in an article of the invention, or in an electrical device, e.g. a heater or a circuit protection device.
申请公布号 IL99742(A) 申请公布日期 1994.05.30
申请号 IL19910099742 申请日期 1991.10.15
申请人 RAYCHEM CORPORATION 发明人
分类号 B29C63/42;B29C61/06;B29C65/68;B29K101/10;C09J5/06;C09J7/00;C09J7/02;C09J163/00;F16L13/10;H01C7/02 主分类号 B29C63/42
代理机构 代理人
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