| 摘要 |
<p>PURPOSE:To obtain a conductive adhesion film containing a specific polyimide resin and a conductive filler, excellent in heat resistance and hot adhesive force and useful for die-bonding materials, etc. CONSTITUTION:This adhesive film comprises (A) 100 pts.wt. of a polyimide resin obtained by reacting a tetracarboxylic acid dianhydride containing a tetracarboxylic acid dianhydride of the formula (n) is 2-20) in an amount of >=70mol.% based on the whole tetracarboxylic acid dianhydride with a diamine such as 1,2-diaminoethane, etc., (B) a conductive filler such as silver powder preferably in an amount of 1-8000 pts.wt., and further preferably (C) a thermosetting resin such as a resin composition containing an epoxy resin, phenolic resin, and a curing accelerating agent preferably in an amount of 0.1-200 pts.wt. The film is preferably nipped with a semi-conductor element and a supporting member and subsequently heated and pressed to adhere the semiconductor to the supporting member.</p> |
