IC CARRIER

摘要

PURPOSE:To enhance attaching and detaching properties and the connection properties at the time of a test in the IC carrier used in the final test of a semiconductor device (IC). CONSTITUTION:In an IC carrier 10 having a surface mounting type IC 1 having constitution such that leads 3 extend from the side part of a package 2 mounted thereon and protecting the IC 1, placing parts 15a-15d having the leads 3 placed thereon are provided on the lower part in the mounting direction of the mounting recessed part 11 having the IC 1 mounted thereon and the IC 1 can be mounted in such a state that the mounting surfaces of the leads 3 are opposed to stages 14a-14d.