发明名称 Modular flooring system using electrically heated floor plates - has interlocking steel-faced three-ply plates, insulated beneath, with embedded elements connected via bus-wires to adjoining plates
摘要 The plate body (1), typically 1m x 0.6m x 0.01m of e.g. water-repellant agglomerate material, having low thermal conductivity and coefficient of expansion, has tongue-and-groove interlocking (1d,1e) on opposing edges, and is sandwiched between an upper galvanised steel sheet (3) and an insulating under-layer (2). Bus-wires (7) run along one side between male (5) and female (6) connectors inset on the interlocking edges. The steel sheet (3) is earthed. The supply wires are tee-connected to a serpentine heating element (4), with overheating cut-out, embedded in the body. Rows of interconnected plates are plugged into inset sockets appropriately spaced along one wall foot. Plates without elements are cut to size to close any uncovered areas in non-modular floors. USE/ADVANTAGE - Esp. in refurbished buildings. Relatively cheap and easily installed.
申请公布号 FR2698432(A1) 申请公布日期 1994.05.27
申请号 FR19920014423 申请日期 1992.11.24
申请人 DELFAGE SA 发明人 LECHNER JACQUES;DELEAGE PHILIPPE
分类号 F24D13/02;(IPC1-7):F24D13/02;H05B3/06 主分类号 F24D13/02
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