发明名称 DENTAL BONDING ARRANGEMENT
摘要 2127882 9410934 PCTABS00032 A dental bonding arrangement for use in attaching a dental inlay (126) or crown onto a dental surface. The bonding arrangement includes a self-supporting, semi-rigid layer of adhesive material (122) positioned between a pair of opposing backing sheets. The adhesive material is of sufficient viscosity to permit contouring of the adhesive along the dental surface (94), and yet of sufficient rigidity to maintain itself erect on the dental surface without flowing. The backing sheets are selectively removed to initially place the adhesive film on the dental surface and, after being positoned, removing the opposing backing sheet (124) and then placing of the dental inlay.
申请公布号 CA2127882(A1) 申请公布日期 1994.05.26
申请号 CA19922127882 申请日期 1992.11.13
申请人 发明人 WEISSMAN, BERNARD
分类号 A61C5/11;(IPC1-7):A61C5/11 主分类号 A61C5/11
代理机构 代理人
主权项
地址