发明名称 SURFACE TREATMENT METHOD OF ELECTRODEPOSITION TYPE PHOTOSENSITIVE RESIN LAYER
摘要 18 Disclosed is a process for surface treating an electrodeposition type photosensitive resin film, comprising electrocoating a photosensitive resin composition on a copper plate for a printed circuit board to form a resist layer, characterized by that an aqueous solution containing a surfactant is applied on the electrodoposited film and then dried.
申请公布号 CA2109678(A1) 申请公布日期 1994.05.26
申请号 CA19932109678 申请日期 1993.11.22
申请人 SEIO, MAMORU;SUGA, KAZUYUKI;NISHIJIMA, KANJI 发明人 SEIO, MAMORU;SUGA, KAZUYUKI;NISHIJIMA, KANJI
分类号 H05K3/06;G03F7/16;H05K3/00;(IPC1-7):C25D3/02;C25D7/00 主分类号 H05K3/06
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