| 摘要 |
A dental bonding arrangement for use in attaching a dental inlay (126) or crown onto a dental surface. The bonding arrangement includes a self-supporting, semi-rigid layer of adhesive material (122) positioned between a pair of opposing backing sheets. The adhesive material is of sufficient viscosity to permit contouring of the adhesive along the dental surface (94), and yet of sufficient rigidity to maintain itself erect on the dental surface without flowing. The backing sheets are selectively removed to initially place the adhesive film on the dental surface and, after being positoned, removing the opposing backing sheet (124) and then placing of the dental inlay. |
