| 摘要 |
The invention relates to a process for production of a copper clad, electrically insulated base for printed circuit boards, wherein a foil, of copper, copper alloy, aluminium or aluminium alloy by electro-plating on preferably both sides furnished with a 1-35 mu m thick unpatterned layer of copper or copper alloy, is under heat and pressure laminated with the copper surfaces facing an electrically insulating, resin containing base. The copper layers are electro-plated onto the foil in such a way that the layers after lamination strongly adhere to the insulating base and at the same time exhibit a very poor adhesion to the foil, which easily can be stripped from the copper layers without splitting these. The foil works during the lamination as a mould plate, whereby conventional mould plates can be excluded. The invention also comprises the use of such a copper clad foil as a combined mould plate and base for the copper layers during the lamination. |
