Metal-core-type multi-layer lead frame.

摘要

A metal-core-type multi-layer lead frame (1) for a semi-conductor device (12) includes a metal core plate (22) on which a semiconductor chip (12) is to be mounted. A plurality of signal lines (20) are formed on the metal core plate (22). A metal plane (24, 30), such as a power supply plane or a ground plane, is laminated on the signal lines (20), through an insulating layer (26) so that an outer peripheral edge of the metal core plate (22) is not covered by the metal plane (24, 30) to expose the outer portion of the signal lines (20). A lead frame body (10) has a plurality of leads (10a) which are electrically connected to the respective signal lines (20) at the outer peripheral edge of the metal core plate (22).