Process for connecting circuits and adhesive film used therefor.

摘要

A process for electrically connecting circuits wherein at least one circuit (4) is provided on an insulating layer (3) and has a plurality of projecting electrodes (2) which are deformable under pressure in the circuit connecting operation, wherein an insulating adhesive having a volatile content of 0.5% or less by weight and comprising (i) a liquid epoxy resin, (ii) a solid resin having one or more functional groups and (iii) a microcapsule type curing agent, in the form of a film (5) having a thickness of 50 mu m or less, is interposed between the circuits and is substantially cured after the projecting electrodes have been contacted with the opposing circuits by applying heat and pressure at the time of connection.