| 摘要 |
<p>PURPOSE:To provide a portable semiconductor device which has electronic parts and circuit which are completely buried therein, and is structurally rigid and environmentally resistant, and can be manufactured in a simple step sequence as well as a method for manufacturing the device. CONSTITUTION:The subject portable semiconductor device is equipped, for example, with a foamed resin storage part 7Ab which stores surplus filling resin in the peripheral part of a case 7 which serves as the outer skin container of an IC card. Further, cell parts such as an IC 3, a cell 4 and parts 5 on the circuit board 2 stored in an electronic part storage part 7Aa, are completely embedded. In addition, the surplus filling resin 10 is stored in a foamed resin storage part 7Ab through a connection groove 7Ac.</p> |
