| 发明名称 |
Resin impregnated laminate for wiring board applications |
| 摘要 |
Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per DEG C, a basis weight of from 0.8 to 4.0 oz/yd2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.
|
| 申请公布号 |
US5314742(A) |
申请公布日期 |
1994.05.24 |
| 申请号 |
US19930041417 |
申请日期 |
1993.03.31 |
| 申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
KIRAYOGLU, BIROL;SILLIVAN, WILLIAM J.;ZUSSMAN, MELVIN P. |
| 分类号 |
C08J5/24;B32B27/04;D04H1/42;D21H13/26;H05K1/03;(IPC1-7):B33B17/00 |
主分类号 |
C08J5/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
