| 摘要 |
PCT No. PCT/JP91/00728 Sec. 371 Date Dec. 30, 1991 Sec. 102(e) Date Dec. 30, 1991 PCT Filed May 30, 1991 PCT Pub. No. WO91/19320 PCT Pub. Date Dec. 12, 1991.A lead frame including a matrix for the lead frame formed of a copper based alloy and an oxide layer formed on the lead frame. A copper based alloy including dispersive particles of which part distributively appears on the surface is used as a matrix for the lead frame. Alternatively, a copper based alloy containing P at a content not more than 30 ppm may be used. In a case where the matrix for the lead frame is formed of a copper based alloy containing dispersive particles, since an oxide layer containing an oxide derived from the dispersive particles is formed on the matrix, a property of adhesiveness of the oxide layer is improved. Also in a case where the matrix for the lead frame is formed of a copper based alloy containing P at a specified content, an oxide layer having excellent adhesiveness can be formed. The oxide layer improves a property of adhesiveness of the sealing plastic as well as reliability on a semiconductor package.
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