| 摘要 |
A process for photo-plating only a light-irradiated portion of a dye layer formed on a substrate comprises: forming a dye layer on the surface of a substrate; immersing the substrate with the dye layer into an electroless plating solution comprising a sacrificial reagent for supplying electrons by irreversible oxidative decomposition, and at least one of copper ions, nickel ions, cobalt ions, and tin ions; and irradiating the surface of the dye layer with light having an energy higher than the excitation energy of the dye in the dye layer. A thick coating containing at least one of copper, nickel, cobalt, and tin can be formed with excellent adhesion strength only on the light-irradiated portion of the dye layer formed on the substrate.
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