发明名称 CONTINUOUS MOLDING OF LAMINATED PLATE
摘要 <p>PURPOSE:To minimize the generation of voids in a laminated plate when manufacturing the laminated plate using a continuous molding technique. CONSTITUTION:A long base material 1 is impregnated with a resin liquid with the concurrent action to feed the base material 1 continuously, then a plruality of pieces of the base material 1 thus impregnated with the resin are fed continuously and atacked, and are allowed to pass through a thermal curing furnace 2 continuously to thermally cure the resin. At the same time, a laminated plate 3 is formed by lamination by laminating the many pieces of the base material 1. In this continuous molding technology, the resin liquid is allowed to flow downward from above to the upper surface of the base material 1, and the base material 1 is impregnated with the resin liuqid with the concurrent blowing of air to the lower surface of the base material 1. Next, the air trapped in the base material 1 is bledded from the lower surface of the base material 1 and at the same time, the resin liquid is allowed to permeate into the base material 1 from the upper surface. It is also possible to bleed the air pent up in the base material 1 from the lower surface of the base material 1 by decompression action generated when the air is blown out to the lower surface of the base material 1.</p>
申请公布号 JPH06143447(A) 申请公布日期 1994.05.24
申请号 JP19920303401 申请日期 1992.11.13
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 AZUMABAYASHI YASUO;IKOMA SUNAO
分类号 B29B11/16;B29C70/06;B29K105/08;B29L9/00;B32B5/28;B32B17/04;B32B37/00;(IPC1-7):B29D9/00;B29C67/14 主分类号 B29B11/16
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