| 摘要 |
The invention relates to a heat-generating electronic circuit board, comprising a board substrate (12) of electrically non-conducting material with at least one circuit pattern (14) formed thereon, on which semiconductors are mounted. The circuit pattern (14) has a section (B) with terminals (16) for contacts. The substrate is divided into a substrate portion (24) supporting semiconductors and a substrate portion (22) separated therefrom and supporting terminals (16) of the circuit pattern, said substrate portions being flexibly held together by the circuit pattern (18) therebetween. The invention also relates to a process for manufacturing such an electronic circuit board, whereby a score (20) is made on one side of the substrate along a portion thereof separating the terminal portion (22) from the semiconductor portion (24), whereafter the substrate is broken along the score and the substrate portions are pulled apart with the portions held at an angle to each other so that freed bridges (18) are formed in the circuit pattern, said bridges flexibly connecting the terminal substrate portion (22) with the semiconductor substrate portion (24). |
