Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device

摘要

PCT No. PCT/JP92/00468 Sec. 371 Date Dec. 22, 1992 Sec. 102(e) Date Dec. 22, 1992 PCT Filed Apr. 14, 1992.An apparatus and method for manufacturing a semiconductor device capable of forming a single layer film or a multilayer film of improved quality by continuously processing without exposure of the wafer to the ambient air. The apparatus includes a film forming section having a gas dispersion unit for supplying reaction gas, a processing section for processing the formed film and a wafer holder for holding a wafer facing the gas dispersion unit or the processing section. The wafer holder moves the wafer between the film forming section and the processing section while heating the wafer by a heating element contained therein.