Conformal heat sink for electronic module

摘要

A system for cooling an electronic module in a computer system. In one embodiment of the invention, predetermined areas of the module, such as those exposed parts that carry electrical currents are covered with an conformable, electrically insulating layer. Thereafter, a second conformable, thermally conductive layer is formed on the first layer. In addition, surface expanding elements may be arranged on the first layer near devices particularly sensitive to heat before the application of the second layer.