HEAT SINK AND SEMICONDUCTOR DEVICE USING SAME

摘要

PURPOSE:To reduce occurrence of warp caused by resin mold by cladding copper or copper alloy member at a part of a substrate comprising Al or Al alloy abutting on a semiconductor element. CONSTITUTION:A heat sink 10 has a substrate 1 and a copper plate or a copper alloy plate 2. The substrate 1 is formed of an aluminum plate. A recess part 1c is formed at the central part of an upper surface 1a, to which a power IC 3 is fixed. The copper plate 2 is compressed to the recess part. The upper surface of the substrate 1 and the surface of the copper plate 2 form the same plane. The power IC 3 is arranged at the central part of the copper plate 3 and rigidly fixed to the copper plate by the soldering to the copper plate 2 having the excellent wettability with solder metal. The power IC 3 is connected to a lead frame 5 through a bonding wire 4. Therefore, the warp, which is generated in the heat sink 10 when the power IC 3 is molded with resin is less, and the semiconductor device having the high dimensional accuracy can be obtained.