发明名称 METHOD AND DEVICE FOR MOLDING SEMICONDUCTOR DEVICE WITH RESIN
摘要 PURPOSE:To provide a preheating device for heating resin tablets thrown in the pot of a metallic mold so that there can be a temperature difference between the tablets. CONSTITUTION:A preheating device is composed of a roller electrode 11 connected to a high-frequency power source (not shown in the figure) and fixed plate electrode 12 facing the electrode 11. Resin tablets 13 and 14 are placed on the electrode 11 and the electrode 11 has a mechanism which rotates the tablets 13 and 14. The electrode 12 has a recessing and projecting section on its surface facing the electrode 11 so that the distance between the electrodes 11 and 12 can become variable.
申请公布号 JPH06140447(A) 申请公布日期 1994.05.20
申请号 JP19920287595 申请日期 1992.10.26
申请人 TOSHIBA CORP 发明人 TAKEI SHINJI;SEITO TSUTOMU
分类号 B29C45/02;B29C45/18;B29C45/73;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/02
代理机构 代理人
主权项
地址