| 摘要 |
PURPOSE:To prevent cracks occurring in a molding resin and to improve quality with regard to a molded type IC package, which is formed by covering an IC chip fixed on a stage with the molding resin. CONSTITUTION:This is a molded type IC package having an IC chip 2, which is fixed to a stage 2, a molding resin 4, which covers the stage 2 and the IC chip 1, and an outer connecting lead 6, which is protruding from the molding resin 4. A first insulating layer 6 comprising elastic material is provided at the interface between the molding resin 4 and the stage 2 and the interface between the molding resin 4 and the IC chip 1. |
