| 摘要 |
PURPOSE:To prevent occurrence of short-circuiting between a wire and another wire or a lead in a semiconductor device using an LOC structure in which the external terminals of a semiconductor pellet 2 are respectively and electrically connected to leads through wires and, at the same time, to reduce the number of the assembling processes of the semiconductor device. CONSTITUTION:In this semiconductor device 1 using an LOC structure, parts of insulating resin films 3 formed between a semiconductor pellet 2 and leads 41 are extended toward an external terminal 21 and protruding bodies 31 which are highly protruded from the surfaces of the leads 41 are formed of the extended parts of the films 3. The protruding bodies 31 are used for controlling the loops of the wires 5. |
