| 摘要 |
PURPOSE:To make a circuit pattern clear and precise by preventing a hard to plate material from partly covering an easy plate material. CONSTITUTION:A primary molded part 1 as a part corresponding to a skelton is formed of an easily bondable resin onto a metallic plating. Next, this primary molded part 1 is inserted into a metallic mold 5 having a cavity 6 in the depth shallower than the thickness of the primary molten part 1. Later, a hardly bondable resin onto the metallic plating is poured into a recession 1b of the primary molded part 1 so as to be clampped for the formation of the secondary molded part 2. Finally, metallic layers 3 are formed by electroless plating step on the protrusions 1a of the primary molded part 1 exposed to the surface of this seconary molded part 2. |
