| 摘要 |
PURPOSE:To enhance a mounting density on a mother board and to decrease labor of mounting a hybrid integrated circuit device on the mother board. CONSTITUTION:In a mounting method of plural hybrid integrated circuit devices 1, 2 on a mother board 3, connectors 11, 15 fitted to respective hybrid integrated circuit devices 1, 2 are electrically connected to each other and then lead terminals 4, 5 fitted to the circuit devices 1, 2 are connected to a specified wiring pattern 6 on the mother board 3. A mounting structure of the plural hybrid integrated circuit devices 1, 2 on the mother board 3 is constituted of the plural circuit devices 1, 2; the mother board 3 equipped with the wiring pattern 6 formed on a main surface thereof; and connectors 11, 15 fitted for directly and electrically connecting the circuit devices 1, 2 to each other. |
