HEAT SINK AND MOUNTING METHOD FOR SEMICONDUCTOR DEVICE USING SAME

摘要

PURPOSE:To reduce manufacturing steps by performing soldering by one step without using two divided steps of a bonding step of a semiconductor device and a heat sink and a bonding step of the heat sink and a circuit board when a semiconductor device is mounted on the circuit board through the heat sink. CONSTITUTION:A semiconductor mounting recess part 6 is formed on a heat sink 1. Then, a semiconductor device 2 is arranged on the heat sink 1 through solder 3b. The heat sink 1 is arranged on an electrode pad 8 on a circuit board 5. These parts are bonded by heating and soldering. Thus, the deviation of the mounting position of the semiconductor device 2 is prevented in heating in the bonding step. Therefore, the semiconductor device 2, the heat sink 1 and the electrode pad 8 on the circuit board 5 can be soldered and bonded in one time.