| 摘要 |
PURPOSE:To provide an electronic component mounting device having a simple constitution for exactly controlling push pressure applied to the electronic components. CONSTITUTION:This device is so constituted that an electronic component mounting device is provided with an adsorption head mechanism 4 for sucking and holding electronic components 3, a head lifting mechanism for lifting and moving the sucking head mechanism 4 toward a printer board 31 at a position for mounting the electronic 3, a board conveyance mechanism 7 for carrying a printed board 31 up to a waiting position below the sucking head mechanism 4 and a board lifting mechanism 8 for lifting and moving the printed board 31 toward the electronic components mounting position, and the board lifting mechanism 8 plants a plurality of board support pins 87 on a lifting board 85. A pin planting board 89 which a plurality of the board support pins 87 vertically movably penetrates on the lifting board 85 is arranged and a force sensor 6 composed of a pressure sensitive conductive rubber sheet is set between the lifting board 85 and the pin planting board 89. |
