Copper@ alloy for use in mfr. of electrical components - contg. nickel@, tin@, silicon@, zinc@, iron@, phosphorus@, and magnesium@

摘要

A copper alloy for use in the mfr. of electrical and electronic components has the following fundamental compsn. in wt.%: 0.5-3 (pref. 1.3-2.7) Ni, 0.1-0.9 (pref. 0.2-0.8) Sn, 0.08-0.8 (pref. 0.2-0.8) Si, 0.1-3 (pref. 0.4-2.0) Zn, 0.007-0.25 (pref. 0.01-0.12) Fe, 0.001-0.2 (pref. 0.002-0.10) P, 0.001-0.2 (pref. 0.001-0.10) Mg, with balance Cu plus unavoidable impurities. USE/ADVANTAGE - In the mfr. of connections for electrical and electronic devices. Alloy exhibits excellent thermal machinability and suitability for punching out plus excellent electrical conductivity, resistance to solder displacement on bending, thermal creep strength and resistance to ion migration compared to conventional copper alloys.