发明名称 |
Device for correcting lateral bends of IC leads |
摘要 |
<p>A device for correcting the lateral bending of IC leads including a mold having comb-shaped pawls 103 which are inserted into respective gaps between IC leads, 101 wherein each of the comb-shaped pawls of the mold includes a contact member 103b which is contacted with only the end portion of each IC lead, the end portions of the IC leads being pushed and spread out in a lateral direction by the contact members of the pawls when the pawls of the mold are inserted into the gaps. Each of the contact members is designed in a wedge shape. <IMAGE></p> |
申请公布号 |
GB2272392(A) |
申请公布日期 |
1994.05.18 |
申请号 |
GB19930022987 |
申请日期 |
1993.11.05 |
申请人 |
* SANYO SILICON ELECTRONICS CO LTD |
发明人 |
TAKAAKI * WAKABAYASHI;TOMIO * UENO |
分类号 |
B21D3/10;H01L23/50;H05K13/00;(IPC1-7):H05K13/04 |
主分类号 |
B21D3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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