| 摘要 |
In order to achieve a compact hybrid power-electronic device which can be produced with little expenditure in terms of time and material, it is proposed to assemble a power unit (9) of the device with the use of a mounting plate (10) which can be designed as a cooling body. Arranged on the mounting plate (10) there is a stacked configuration (11) having insulating material layers (12) and conductor track layers (13) sandwiched alternately above one another. The stacked arrangement (11) has cutouts (14) into which power semiconductor modules (15) without casings are inserted. In or near the cutouts (14) lands (terminal faces) (27) are provided, e.g. by means of the layers (12, 13) being stepped, which lands make it possible to establish electrical connections between the conductor track layers (13) and the modules (15). <IMAGE> |
