TEST STRUCTURE FOR MULTI-LAYER, THIN-FILM MODULES

摘要

A corner test structure for multi-layer thin-film modules. In the corner of each layer a test structure is formed as part of the process for forming the layer itself. This corner test structure is designed to emulate the wiring pattern of the layer itself in terms of density and pattern. Each test site also includes vias for forming, in combination with vias from preceding and succeeding layers, via chain which emulate the via chains extending through the active wiring region of the module itself. Each test site structure includes a large array of test pads only a few of which are used at any given layer. The entire test pad array of each level is connected by vias to the test pattern on adjoining levels so that a test structure pattern at a given layer may be accessed from pads at each succeeding level and from pads on the upper surface of the completed module.