| 摘要 |
<p>On a printed circuit board (1) according to the present invention, there are arranged IC packages (3) in a matrix layout, which are soldered to the printed circuit board (1) via their lead wires (3a, 3b) provided on the package sides, and there are chip Components (4) soldered to the printed circuit board (1) under each of the IC packages (3) and the printed circuit board (1), on lines (E-E min ) angularly deviated from the low lines or the column lines (Y1, Y2, ...) of the matrix. Thus, the soldered portion of a chip component (4) behind its adjacent chip component can be visually checked along a view-line (F1, F1 min , ...) parallel to the row line or the column line (Y1, Y2 ...), while achieving a highly integrated printed circuit board.</p> |
