| 摘要 |
PURPOSE:To obtain a thermosetting resin molded product capable of forming a receiving space excellent in hermetical sealing properties by bringing a second powder molded product into contact with a first powder molded product so as to cover a part of the recessed part of the first powder molded product composed of a thermosetting resin to perform molding under heating. CONSTITUTION:A heated punch 16 is inserted in the recessed part 15a of first powder molded product 15 composed of a thermosetting resin to cure the inner surface of the recessed part 15a. Next, an electronic part element 17 is arranged on the first powder molded product 15 and a second powder molded product 18 is arranged on the first powder molded product 15 so as to hold the metal terminals 17b, 17c extending to the outside from the first powder molded product 15 between both products 15, 18. Next, the combination of the first powder molded product 15, the electronic part element 17 and the second powder molded product 18 is received in a heated mold 19 to be molded under heating. By this constitution, the bonding strength of the bonding surfaces of the powder molded products is sufficiently increased. |
