发明名称 |
DIE ATTACH ADHESIVE COMPOSITIONS |
摘要 |
A solid adhesive composition which is suitable for the very rapid attachment of IC chips to high surface energy substrates comprising flake silver particles dispersed in solid matrix consisting essentially of a thermoplastic phenoxy resin and a small amount of thermally crosslinkable resin. |
申请公布号 |
KR940004204(B1) |
申请公布日期 |
1994.05.17 |
申请号 |
KR19910006679 |
申请日期 |
1991.04.25 |
申请人 |
E.I. DU PONT DE NEMOURS & CO. |
发明人 |
CHAN, MAN-SHEUNG |
分类号 |
C09J9/02;C09J11/04;C09J161/06;C09J161/20;C09J161/28;C09J171/00;C09J171/10;H01B1/22;H01L21/52;H01L23/482 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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