MANUFACTURE OF MULTILAYER INTERCONNECTION BOARD

摘要

PURPOSE:To improve adhesive force between layers without trouble about a treatment process with chemicals. CONSTITUTION:A surface of copper 2 included in an inner-layer part 3, which is made up of an insulating board 1 with the copper 2 at a face part thereof, is roughened in an ionized gas. With this inner-layer part 3, a multi-layer interconnection board (A) is produced in a laminating step. In this way, the surface of the copper part 2 is roughened in an ionized gas without using a treatment process with chemicals so that adhesive force between layers can be improved.