MANUFACTURE OF LIGHT-EMITTING DIODE

摘要

PURPOSE:To provide a manufacture of a light-emitting diode capable of improving the electrical resistance reliability in the range from low temperature to high temperature. CONSTITUTION:A predetermined quantity of antioxidant is added while one wt.% or more of curing accelerator is added to the total weight of a sealing resin 5. A primary curing is performed at a temperature of 110 deg.C to 120 deg.C, and then an after-cure is performed at a temperature of 140 deg.C or higher. By performing the above treatments, the interface between the sealing resin 5 and a lead frame 1a is formed to a peeling state (x).