| 摘要 |
<p>PURPOSE:To restrain that a void is produced at the inside of a package main body for a resin-sealed semiconductor package by a method wherein a cutout part which discharges a gas inside a resin-molding metal mold to the outside is formed in a part coming into contact with the resin-molding metal mold in a resin-sealing operation. CONSTITUTION:In order to mold a resin-sealed semiconductor package 20, a lead frame 10 is mounted on a resin-molding metal mold and it is sealed with a resin injected into the resin-molding metal mold. The lead frame 10 is provided with a frame part 11, with a cutout part 12 and with a die pad 13 used to fix and bond a semiconductor chip 21. Especially, the cutout part 12 is formed in a part coming into contact with the resin-molding metal mold in a resin sealing operation so that a gas inside the resin-sealing metal mold is discharged to the outside. Consequently, the gas inside the resin-sealing metal mold which could not be discharged by a vent in the resin-molding metal mold can be discharged to the outside from the cutout part 12.</p> |
