| 摘要 |
PURPOSE:To provide a multilayer thin film interconnection board which forms a pre-circuit pattern without forming a channel-shaped resist pattern with excellent dimensional accuracy and adhesiveness. CONSTITUTION:A doubled-layer structured pre-circuit pattern Pc is formed on an insulating layer 11. The pre-circuit pattern Pc is composed of a Cr thin film L1 and a Cu thin film L2. A Cu layer L3 is deposited on the pre-circuit pattern Pc by electroless plating. An Ni thin film L4 is formed on the Cu layer L3 by electroless plating. Then, an insulating layer 12 formed of photosensitive resin is formed on a circuit pattern C2. A multilayer thin film interconnection board is manufactured by repeating such processes. |
