| 摘要 |
PURPOSE:To obtain the semiconductor package in which a current flows to the grounding or a power source in the switched direction when the output buffer of a TTL and a CMOS is switched, the electromotive force corresponging to the inductance of the power source or the grounding is generated, this electromotive force is turned into noise, and a signal is made larger in proportion to the increases in speed. CONSTITUTION:The power source of a multilayer tab substrate or printed substrate 3, consisting of two or more layers, and a grounding 5 are connected by a bypass capacitor 2, and a bypass capacitor 2 is positioned in the vicinity of a semiconductor chip 1 in the semiconductor package. As a result, when the power source and the grounding are connected by the by pass capacitor 2, a high frequency signal is passed through the resistor of the capacitor easily. As a result, the boosting of electromotive force can be suppressed, a high speed low noise package can be realized and also as power source/grounding are connected by the bypass capacitor in the neighborhood of the chip, the efficiency of the package becomes great. |
