| 摘要 |
<p>PURPOSE:To provide a vacuum suction stage which is able to chuck a wafer, wherein the outer peripheral part of the wafer is hardly warped. CONSTITUTION:A quartz suction stage 1 which vacuum-chucks a semiconductor wafer or a glass substrate is provided, a continuous vertical wall 7 as high as prescribed is provided to the peripheral edge of the stage 1, vertical projections 5 large in outer diameter are provided onto the upside of the stage 1 surrounded by the vertical wall 7, surrounding vertical projections 3 small in outer diameter and provided onto the stage 1, and the vertical wall 7 and the projections 3 and 5 are all set equal in height.</p> |
