| 摘要 |
<p>PURPOSE:To ensure insulation by providing a lead frame body part having a plurality of inner leads and outer leads, and a semiconductor element mounting part which is bonded to the tip part of inner lead through an adhesive layer containing dielectric particles. CONSTITUTION:A lead frame body part comprises a plurality of inner leads 1 extending radially at a predetermined interval from a semiconductor element mounting part, and a plurality of outer leads 3 formed integrally with the inner leads while extending therefrom. A heat plate 7 is bonded to the inner leads 1, at the tips thereof, through an adhesive layer 4 containing dielectric particles 4s. In this lead frame, the inner lead 1 extending toward the semiconductor element mounting part is connected, at the tip thereof, with a semiconductor chip 5 through a bonding wire 6. A gap is kept constantly between the lead frame body and the heat plate 7 thus ensuring insulation.</p> |
