MANUFACTURE OF MULTILAYER INTERCONNECTION BOARD

摘要

PURPOSE:To improve an anti-haloing characteristic in multilayer interconnection board without trouble about a treatment process with chemicals or in a high- temperature gas atmosphere. CONSTITUTION:A surface of copper 2 in an inner-layer part 3 is oxidized. The inner-layer part 3 is made up of an insulating board 1 and the copper 2 at the face thereof. An outer-layer part 5 is piled on the inner-layer part 3 with a piece of prepreg in between. After these layered parts are bonded, a through hole 7 is drilled, and the inside of the through hole 7 is plated with copper so as to form a multi-layer interconnection board. In this step, the laminated layers are bonded after a surface copper oxide material 4 in the oxidized copper 2 is reduced chemically in an atmosphere of ionization. Since the chemical reduction is carried out in an atmosphere of ionization, the productive step can be made free from such problems in a chemical treatment process with an aqueous chemical or in a high-temperature gas atmosphere.