| 摘要 |
<p>PURPOSE:To eliminate a stress to be applied to connected parts of outer leads to a board even if a thermal stress is applied after a semiconductor device is connected to the board. CONSTITUTION:A connecting interval (w) of outer leads 1 are set to w=1/4W from a ratio of 1:4 of thermal expansion coefficients of a semiconductor device to a board 2 and an entire width W of the device, thereby theoretically setting a ratio of the thermal expansion coefficients of the device to the board 2 to 1. Thus, a malfunction in which the outer leads are peeled from the board is eliminated.</p> |
