THREE-DIMENSIONAL STRUCTURE ELECTRONIC COMPONENT AND MANUFACTURE THEREOF,申请号JP19920277122-传众专利搜索

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发明名称	THREE-DIMENSIONAL STRUCTURE ELECTRONIC COMPONENT AND MANUFACTURE THEREOF
摘要
申请公布号	JPH06132623(A)	申请公布日期	1994.05.13
申请号	JP19920277122	申请日期	1992.10.15
申请人	FUJITSU LTD	发明人	KOMIYAMA TAKESHI
分类号	H01L25/18;H01L25/10;H01L25/11;H05K1/14;H05K3/34;(IPC1-7):H05K1/14	主分类号	H01L25/18
代理机构		代理人
主权项
地址

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