METAL BASE MULTI LAYER INTERCONNECTION SUBSTRATE

摘要

PURPOSE:To provide a structure that a large current flows through a plurality of wire layers in a metal base multilayer interconnection substrate, and that a power element can be mounted to a part of the multilayer interconnection substrate so as to readily manufacture it. CONSTITUTION:A lower surface wire layer 106 is connected with a metal base 101 through an insulation layer (first insulation layer) 103. A wire substrate 102 is structured with an insulation layer (second insulation layer) 105 and an upper surface wire layer 104 composed of glass epoxy. A hole 107 and a through hole 109 are formed in a specific location of the wire layer 4 and insulation layer 105. The hole 107 is filled with conductive paste (conductive filling member) 130, whereby the upper surface wire layer 104 is electrically connected with a lower surface wire layer 106. A power electrode 120 is arranged in the through hole 109 and solder to the lower surface wire layer.