| 摘要 |
<p>PURPOSE:To obtain a surface mounting-type resin-sealed semiconductor device wherein a steam explosion is hard to cause in a mounting operation. CONSTITUTION:Slits 10 by a composite cross-shaped slit arrangement are formed in a tab 4, only four divided tab regions at four corners out of nine divided tab regions 11 which have been partitioned by the slits and the edge of the tab are coated with a coating paste 12 composed of an Ag paste in a ship bonding operation, and a semiconductor element 5 is fixed. The Ag paste 8 is made thin at about 15 to 25mum. Since the Ag paste 8 is thin and partial, its moisture-absorbing amount is reduced, and a steam explosion due to moisture absorbed by the Ag paste is not caused in the reflow mounting operation of a semiconductor device. As a result, a molded resin is not cracked, the tab 4 is not exfoliated from the semiconductor element 5 and a wire is not fractured.</p> |
