发明名称 POLISHING METHOD AND DEVICE
摘要 PURPOSE:To provide a polishing method and device by which the peripheral edge of each plateau part of a work where with angular plateau part is formed on a polishing surface is chamfered and polished to be twin-spherical machined extending over the whole periphery. CONSTITUTION:At the time of chamfering and polishing each plateau part peripheral edge of a work so as to apply twin-spherical machining there to where twin angular plateau parts are formed, a work is installed on an elastic fitting jig, and a plateau part is brought into pressure contact with a polishing disc in such an attitude as to hold the plateau part top end surface in parallel to the polishing disc while the posture is detected, and the fitting jig and the polishing disc are rotated to polish the work. The device comprises a freely rotated polishing disc 7, a fitting jig 8 freely rotated and adjustable in posture in which a work 1 plateau parts 1d, 1e formed is fitted to an elastic fitting member 10, with its polishing surface positioned on the obverse side in such a manner as to hold the plateau part top end surface parallel to the polishing disc 7, the plateau parts 1d, 1e being brought into pressure contact with the polishing disc 7 to twin-spherical polish the work 1, and a sensor means 9 for detecting the posture of a work and detecting the parallel postures of the plateau parts 1d, 1e and the polishing disc 7.
申请公布号 JPH06126604(A) 申请公布日期 1994.05.10
申请号 JP19920278239 申请日期 1992.10.16
申请人 NEC KANSAI LTD 发明人 MUKAIDE NORIAKI
分类号 B24B9/00;B24B37/04;B24B37/07;B24B37/30;G11B17/32 主分类号 B24B9/00
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