发明名称 Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
摘要 A method wherein wafers are transferred between a loading chamber and a central vacuum chamber. A plurality of first vacuum processing chambers are disposed in a satellite relationship around the central chamber. A plurality of second non-vacuum chambers are interspersed with the first chambers in a satellite relationship around the central chamber. A second central vacuum chamber communicates with one of the first chambers through a valve. Third and fourth pluralities of chambers are disposed in a satellite relationship around the second central chamber to respectively perform functions similar to those performed by the first and second chambers, the fourth chambers being interspersed with the third chambers.
申请公布号 US5310410(A) 申请公布日期 1994.05.10
申请号 US19910807162 申请日期 1991.12.13
申请人 SPUTTERED FILMS, INC. 发明人 BEGIN, ROBERT G.;CLARKE, PETER J.
分类号 C23C14/56;(IPC1-7):C23C14/00;C23C16/00;C23C13/08 主分类号 C23C14/56
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