发明名称 |
Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus |
摘要 |
A method wherein wafers are transferred between a loading chamber and a central vacuum chamber. A plurality of first vacuum processing chambers are disposed in a satellite relationship around the central chamber. A plurality of second non-vacuum chambers are interspersed with the first chambers in a satellite relationship around the central chamber. A second central vacuum chamber communicates with one of the first chambers through a valve. Third and fourth pluralities of chambers are disposed in a satellite relationship around the second central chamber to respectively perform functions similar to those performed by the first and second chambers, the fourth chambers being interspersed with the third chambers.
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申请公布号 |
US5310410(A) |
申请公布日期 |
1994.05.10 |
申请号 |
US19910807162 |
申请日期 |
1991.12.13 |
申请人 |
SPUTTERED FILMS, INC. |
发明人 |
BEGIN, ROBERT G.;CLARKE, PETER J. |
分类号 |
C23C14/56;(IPC1-7):C23C14/00;C23C16/00;C23C13/08 |
主分类号 |
C23C14/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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