| 摘要 |
PURPOSE:To obtain an epoxy resin compsn. useful for sealing a photosemiconductor device, causing a low stress in the device, and being excellent in clarity and heat resistance by compounding an epoxy resin, an acid anhydride, a cure accelerator, and a thermoplastic satd. copolyester resin. CONSTITUTION:An epoxy resin compsn. is prepd. by compounding an epoxy resin, an acid anhydride, a cure accelerator, and a thermoplastic satd. copolyester resin in an amt. of the copolyester resin of pref. 2-20wt.% based on the compsn. |
